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Proceedings Paper

Material removal rate based on edge effects in ultraprecision polishing process
Author(s): Wei Yang; YinBiao Guo; Qiao Xu
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Paper Abstract

Based on the edge effects in the ultra precision polishing process, a revised skin model is used to predict material removal rate (MRR) of circular wafer. With force equation and torque equation, in order to calculate the skin width and the pressure distribution, a revised formula is given. According to Preston's equation, by using Math-Cad software, the material removal rate (MRR) of circular wafer is simulated, and two factors which influence MRR are discussed.One is the distance between the circular wafer center and the polishing tool center; the other is the ratio of the angular velocity of circular wafer to the polishing tool angular velocity.

Paper Details

Date Published: 21 May 2009
PDF: 6 pages
Proc. SPIE 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 72820A (21 May 2009); doi: 10.1117/12.830791
Show Author Affiliations
Wei Yang, Xiamen Univ. (China)
YinBiao Guo, Xiamen Univ. (China)
Qiao Xu, Chengdu Fine Optical Engineering Research Ctr. (China)


Published in SPIE Proceedings Vol. 7282:
4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies

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