Share Email Print
cover

Proceedings Paper

Engine for characterization of defects, overlay, and critical dimension control for double exposure processes for advanced logic nodes
Author(s): Steven Holmes; Chiew-Seng Koay; Karen Petrillo; Kuang-Jung Chen; Matthew E. Colburn; Jason Cantone; Kenichi Ueda; Andrew Metz; Shannon Dunn; Youri van Dommelen; Michael Crouse; Judy Galloway; Emil Schmitt-Weaver; Aiquin Jiang; Robert Routh; Cherry Tang; Mark Slezak; Sumanth Kini; Tony DiBiase
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

As our ability to scale lithographic dimensions via reduction of actinic wavelength and increase of numerical aperture (NA) comes to an end, we need to find alternative methods of increasing pattern density. Double-Patterning techniques have attracted widespread interest for enabling further scaling of semiconductor devices. We have developed DE2 (develop/etch/develop/etch) and DETO (Double-Expose-Track-Optimized) methods for producing pitch-split patterns capable of supporting 16 and 11-nm node semiconductor devices. The IBM Alliance has established a DETO baseline in collaboration with KT, TEL, ASML and JSR to evaluate commercially available resist-on-resist systems. In this paper we will describe our automated engine for characterizing defectivity, line width and overlay performance for our DETO process.

Paper Details

Date Published: 1 April 2009
PDF: 13 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727305 (1 April 2009); doi: 10.1117/12.828483
Show Author Affiliations
Steven Holmes, IBM Corp. (United States)
Chiew-Seng Koay, IBM Corp. (United States)
Karen Petrillo, IBM Corp. (United States)
Kuang-Jung Chen, IBM Corp. (United States)
Matthew E. Colburn, IBM Corp. (United States)
Jason Cantone, Tokyo Electron America, Inc. (United States)
Kenichi Ueda, Tokyo Electron America, Inc. (United States)
Andrew Metz, Tokyo Electron Technology Ctr., America, LLC (United States)
Shannon Dunn, Tokyo Electron Technology Ctr., America, LLC (United States)
Youri van Dommelen, ASML (United States)
Michael Crouse, ASML (United States)
Judy Galloway, ASML (United States)
Emil Schmitt-Weaver, ASML (United States)
Aiquin Jiang, ASML (United States)
Robert Routh, ASML (United States)
Cherry Tang, JSR Micro, Inc. (United States)
Mark Slezak, JSR Micro, Inc. (United States)
Sumanth Kini, KLA-Tencor New York (United States)
Tony DiBiase, KLA-Tencor New York (United States)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

© SPIE. Terms of Use
Back to Top