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Proceedings Paper

Defectivity issues in topcoat-free photoresists
Author(s): Karen Petrillo; Rick Johnson; Will Conley; Jason Cantone; Dave Hetzer; Shannon Dunn; Tom Winter; Youri van Dommelen; Aiqin Jiang
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Paper Abstract

One method being used to reduce the overall lithography process complexity and cost is to utilize a topcoat-less photoresist. Development of these materials utilizes an additive to prevent water penetration and thus forms the same surface property characteristics created by advanced topcoats. The main challenge for topcoat-less resists is increasing the hydrophobicity without causing too much inhibition at the resist surface - which can lead to bridging or residue defects. The key to such a design is in the balance between leaching control versus dissolution characteristics of the resist without disregarding lithography performance and increasing defectivity. The addition of materials into existing ArF photoresists systems have been shown to modulate the contact angle in water-based immersion lithography. The authors have focused this work on the reduction of defects to achieve defectivity levels that are equal or better than existing systems.

Paper Details

Date Published: 1 April 2009
PDF: 9 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72732C (1 April 2009); doi: 10.1117/12.828291
Show Author Affiliations
Karen Petrillo, IBM Corp. (United States)
Rick Johnson, IBM Corp. (United States)
Will Conley, FreeScale, IBM Systems & Technology Group (United States)
Jason Cantone, Tokyo Electron Technology Ctr. (United States)
Dave Hetzer, Tokyo Electron Technology Ctr. (United States)
Shannon Dunn, Tokyo Electron Technology Ctr. (United States)
Tom Winter, Tokyo Electron America, Inc. (United States)
Youri van Dommelen, ASML Ltd. (United States)
Aiqin Jiang, ASML Ltd. (United States)

Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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