Share Email Print

Proceedings Paper

Dynamic evaluation of lateral and vertical displacement of thermally actuated MEMS devices
Author(s): Kalle Hanhijärvi; Juha Aaltonen; Ivan Kassamakov; Lauri Sainiemi; Kestutis Grigoras; Sami Franssila; Edward Hæggström
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Scanning white light interferometry (SWLI) allows dynamic full-field 3D profiling of MEMS devices. With stroboscopic illumination periodic out-of-plane oscillation can be characterized, but in-plane movement is unresolved. We combine stroboscopic SWLI with image processing to concurrently characterize periodic out-of-plane and in-plane displacement. A difference in frequency is induced between the sample excitation and stroboscopic illumination signals. The difference frequency is chosen to allow recording the surface movement at video rate. The stroboscopic image is thus no longer frozen in time, but moves at frequency equal to the difference in stroboscopic frequencies. This motion is captured with a CCD camera. The surface velocity is extracted from the apparent motion using optical flow algorithms. For concept validation we characterize the in-plane and out-of-plane movement of thermal microbridges fabricated on silicon-oninsulator by deep reactive ion etching. The microbridge geometry was designed for in-plane movement with minor outof plane deflection.

Paper Details

Date Published: 17 June 2009
PDF: 10 pages
Proc. SPIE 7389, Optical Measurement Systems for Industrial Inspection VI, 73892Z (17 June 2009); doi: 10.1117/12.827522
Show Author Affiliations
Kalle Hanhijärvi, Univ. of Helsinki (Finland)
Juha Aaltonen, Univ. of Helsinki (Finland)
Ivan Kassamakov, Helsinki Univ. of Technology (Finland)
Lauri Sainiemi, Helsinki Univ. of Technology (Finland)
Kestutis Grigoras, Helsinki Univ. of Technology (Finland)
Sami Franssila, Helsinki Univ. of Technology (Finland)
Edward Hæggström, Univ. of Helsinki (Finland)

Published in SPIE Proceedings Vol. 7389:
Optical Measurement Systems for Industrial Inspection VI
Peter H. Lehmann, Editor(s)

© SPIE. Terms of Use
Back to Top