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Proceedings Paper

Rapid reactive transfer printing of CIGS photovoltaics
Author(s): Louay Eldada; Baosheng Sang; Matthew Taylor; Peter Hersh; Billy J. Stanbery
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Paper Abstract

We demonstrate photovoltaic integrated circuits (PVIC) with high-quality large-grain Copper Indium Gallium Selenide (CIGS) obtained with the unique combination of low-cost ink-based or Physical Vapor Deposition (PVD) based nanoengineered precursor thin films and a reactive transfer printing method. Reactive transfer is a two-stage process relying on chemical reaction between two separate precursor films to form CIGS, one deposited on the substrate and the other on a printing plate in the first stage. In the second stage, these precursors are brought into intimate contact and rapidly reacted under pressure in the presence of an electrostatic field while heat is applied. The use of two independent thin films provides the benefits of independent composition and flexible deposition technique optimization, and eliminates pre-reaction prior to the synthesis of CIGS. High quality CIGS with large grains on the order of several microns, and of preferred crystallographic orientation, are formed in just several minutes based on compositional and structural analysis by XRF, SIMS, SEM and XRD. Cell efficiencies of 14% and module efficiencies of 12% have been achieved using this method. When atmospheric pressure deposition of inks is utilized for the precursor films, the approach additionally provides further reduced capital equipment cost, lower thermal budget, and higher throughput.

Paper Details

Date Published: 26 August 2009
PDF: 15 pages
Proc. SPIE 7409, Thin Film Solar Technology, 74090N (26 August 2009); doi: 10.1117/12.827487
Show Author Affiliations
Louay Eldada, HelioVolt Corp. (United States)
Baosheng Sang, HelioVolt Corp. (United States)
Matthew Taylor, HelioVolt Corp. (United States)
Peter Hersh, HelioVolt Corp. (United States)
Billy J. Stanbery, HelioVolt Corp. (United States)


Published in SPIE Proceedings Vol. 7409:
Thin Film Solar Technology
Alan E. Delahoy; Louay A. Eldada, Editor(s)

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