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Proceedings Paper

A novel digital image sensor with row wise gain compensation for Hyper Spectral Imager (HySI) application
Author(s): Shengmin Lin; Chi-Pin Lin; Weng-Lyang Wang; Feng-Ke Hsiao; Robert Sikora
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Paper Abstract

A 256x512 element digital image sensor has been developed which has a large pixel size, slow scan and low power consumption for Hyper Spectral Imager (HySI) applications. The device is a mixed mode, silicon on chip (SOC) IC. It combines analog circuitry, digital circuitry and optical sensor circuitry into a single chip. This chip integrates a 256x512 active pixel sensor array, a programming gain amplifier (PGA) for row wise gain setting, I2C interface, SRAM, 12 bit analog to digital convertor (ADC), voltage regulator, low voltage differential signal (LVDS) and timing generator. The device can be used for 256 pixels of spatial resolution and 512 bands of spectral resolution ranged from 400 nm to 950 nm in wavelength. In row wise gain readout mode, one can set a different gain on each row of the photo detector by storing the gain setting data on the SRAM thru the I2C interface. This unique row wise gain setting can be used to compensate the silicon spectral response non-uniformity problem. Due to this unique function, the device is suitable for hyper-spectral imager applications. The HySI camera located on-board the Chandrayaan-1 satellite, was successfully launched to the moon on Oct. 22, 2008. The device is currently mapping the moon and sending back excellent images of the moon surface. The device design and the moon image data will be presented in the paper.

Paper Details

Date Published: 12 August 2009
PDF: 8 pages
Proc. SPIE 7458, Remote Sensing System Engineering II, 745805 (12 August 2009); doi: 10.1117/12.826505
Show Author Affiliations
Shengmin Lin, CMOS Sensor, Inc. (United States)
Chi-Pin Lin, CMOS Sensor, Inc. (Taiwan)
Weng-Lyang Wang, CMOS Sensor, Inc. (United States)
Feng-Ke Hsiao, CMOS Sensor, Inc. (Taiwan)
Robert Sikora, CMOS Sensor, Inc. (United States)


Published in SPIE Proceedings Vol. 7458:
Remote Sensing System Engineering II
Philip E. Ardanuy; Jeffery J. Puschell, Editor(s)

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