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Proceedings Paper

The thermal conductivity of alumina thin film for LED
Author(s): Ming-Seng Hsu; Chung-Chih Chang; Hsiang-Hsi Cheng; Yueh Ouyang; Yau-Chyr Wang
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Paper Abstract

Thermal management has the important influence in quantum effect of light emitting diodes (LED) based on printed circuit board (PCB). In the industrial processing, the quality of the thermal dissipation is decided by the gumming technique between the PCB and aluminum plate. Because it transfers the heat from electric device to the aluminum plate, which completely removes the heat. In this study, a superior method, alumina thin films, soldered the LED lamps to enhance the heat transfer. The films were fabricated onto 1070 aluminum alloy substrate by plasma spraying, vacuum sputtering and electric plating technologies. The dielectric coatings were characterized by several subsequent analyses, especially the measurement of thermal resistance. The X-Ray diffraction (XRD) diagram analysis reveals that alumina phases were successfully grown on the individual substrate. Compared to alumina coating fabricated by plasma spraying and electric plating technologies, vacuum sputtering creates low sheet resistivity, high hardness, high critical load, and good thermal conduction of 119 W/m-K.

Paper Details

Date Published: 21 August 2009
PDF: 8 pages
Proc. SPIE 7420, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications III, 742012 (21 August 2009); doi: 10.1117/12.825657
Show Author Affiliations
Ming-Seng Hsu, Chinese Military Academy (Taiwan)
Chung-Chih Chang, Chinese Military Academy (Taiwan)
Hsiang-Hsi Cheng, Chinese Military Academy (Taiwan)
Yueh Ouyang, Chinese Military Academy (Taiwan)
Yau-Chyr Wang, Neo-Zeon Institute of Technology (Taiwan)


Published in SPIE Proceedings Vol. 7420:
Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications III
Shizhuo Yin; Ruyan Guo, Editor(s)

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