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Proceedings Paper

Implementation strategy of wafer-plane and aerial-plane inspection for advanced mask manufacture
Author(s): Won-Sun Kim; Dong-Hoon Chung; Chan-Uk Jeon; HanKu Cho; William Huang; John Miller; Gregg Inderhees; Becky Pinto; Jiuk Hur; Kihun Park; Jay Han
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Paper Abstract

Inspection of aggressive Optical Proximity Correction (OPC) designs, improvement of usable sensitivity, and reduction of cost of ownership are the three major challenges for today's mask inspection methodologies. In this paper we will discuss using aerial-plane inspection and wafer-plane inspection as novel approaches to address these challenges for advanced reticles. Wafer-plane inspection (WPI) and aerial-plane inspection (API) are two lithographic inspection modes. This suite of new inspection modes is based on high resolution reflected and transmitted light images in the reticle plane. These images together with scanner parameters are used to generate the aerial plane image using either vector or scalar models. Then information about the resist is applied to complete construction of the wafer plane image. API reports defects based on intensity differences between test and reference images at the aerial plane, whereas WPI applies a resist model to the aerial image to enhance discrimination between printable and non-printable defects at the wafer plane. The combination of WPI and API along with the industry standard Reticle Plane Inspection (RPI) is designed to handle complex OPC features, improve usable sensitivity and reduce the cost of ownership. This paper will explore the application of aerial-plane and wafer-plane die-to-die inspections on advanced reticles. Inspection sensitivity, inspectability, and comparison with Aerial Imaging Measurement System (AIMSTM[1]) or wafer-print-line will be analyzed. Most importantly, the implementation strategy of a combination of WPI and API along with RPI leading-edge mask manufacturing will be discussed.

Paper Details

Date Published: 11 May 2009
PDF: 12 pages
Proc. SPIE 7379, Photomask and Next-Generation Lithography Mask Technology XVI, 73791C (11 May 2009); doi: 10.1117/12.824289
Show Author Affiliations
Won-Sun Kim, Samsung Electronics, Co. Ltd. (Korea, Republic of)
Dong-Hoon Chung, Samsung Electronics, Co. Ltd. (Korea, Republic of)
Chan-Uk Jeon, Samsung Electronics, Co. Ltd. (Korea, Republic of)
HanKu Cho, Samsung Electronics, Co. Ltd. (Korea, Republic of)
William Huang, KLA-Tencor Corp. (United States)
John Miller, KLA-Tencor Corp. (United States)
Gregg Inderhees, KLA-Tencor Corp. (United States)
Becky Pinto, KLA-Tencor Corp. (United States)
Jiuk Hur, KLA-Tencor Korea (Korea, Republic of)
Kihun Park, KLA-Tencor Korea (Korea, Republic of)
Jay Han, KLA-Tencor Korea (Korea, Republic of)

Published in SPIE Proceedings Vol. 7379:
Photomask and Next-Generation Lithography Mask Technology XVI
Kunihiro Hosono, Editor(s)

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