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Proceedings Paper

Heat transfer in minichannels and microchannels CPU cooling systems
Author(s): Ioan C. Mihai
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Paper Abstract

A CPU functioning is extremely complex and it was experimentally revealed that a direct dependence between working speed and cooling degree exists. When the contact between two surfaces is imperfect, the specific thermal resistance of interface layer suddenly increases, so it became of frequent use to apply diverse materials between the CPU and radiator. These materials should both fill the gaps occurred due to surfaces roughness, material's fatigue, loading pressure etc. and transfer as much heat as possible during a short period of time. In order to ensure an appropriate cooling, other complementary methods are used, such as coolers, water or other liquids cooling, Peltier effect and even freon micro-refrigerating systems. In either situation, there are micro or nano channels through which fluids flow and thermal exchange takes place. The present paper aims to analyze the heat transfer under the mentioned conditions, considering the micro or nano scale dimensions of the channels. The thermal calculus can differ with respect to Kn number and for this case for thermal modelling diverse mathematical models can be realized. The model used is validated by comparing the results to numerical results obtained by authors from literature.

Paper Details

Date Published: 7 January 2009
PDF: 5 pages
Proc. SPIE 7297, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IV, 72971N (7 January 2009); doi: 10.1117/12.823670
Show Author Affiliations
Ioan C. Mihai, Stefan cel Mare Univ. (Romania)


Published in SPIE Proceedings Vol. 7297:
Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IV
Paul Schiopu; Cornel Panait; George Caruntu; Adrian Manea, Editor(s)

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