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Proceedings Paper

Metal wafer bonding for low temperature MEMS applications
Author(s): Viorel Dragoi; Franz Murauer; Erkan Cakmak; Eric Pabo
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Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, ; doi: 10.1117/12.821721
Show Author Affiliations
Viorel Dragoi, EV Group E. Thallner GmbH (Austria)
Franz Murauer, EV Group E. Thallner GmbH (Austria)
Erkan Cakmak, EV Group Inc. (United States)
Eric Pabo, EV Group Inc. (United States)


Published in SPIE Proceedings Vol. 7362:
Smart Sensors, Actuators, and MEMS IV
Ulrich Schmid, Editor(s)

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