Share Email Print
cover

Proceedings Paper

High-resolution eddy current sensor system
Author(s): Martin H. Schulze; Henning Heuer; Martin Küttner
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Carbon fiber materials become more and more important for many applications. Unlike to metal, the technological parameters and certificated quality control mechanisms have not been developed yet. There is no efficient and reliable testing system for an inline inspection and a consecutively manual inspection of the Raw Carbon Fiber materials (RCF) and the post laminated Carbon Fiber Reinforced Plastics (CFRP). Based upon the multi-frequency Eddy Current device developed at Fraunhofer IZFP structural and hidden defects such as missing carbon fiber bundles, lanes, suspensions, fringes, missing sewing threads and angle errors can be detected. Due to the help of an optimized sensor array and an intelligent image pre-processing algorithm the complex impedance signal can be allocated to different carbon fiber layers. This technique enables the possibility to detect defects in the depth up to 5 layers including the option of free scale resolution and testing frequency. Appropriate parameter lists for an optimal error classification are available. The dimensions of the smallest detectable defects are in the range of a few millimeters. A prototype of a special single sensor and an eddy-current sensor array are developed and establish the way to transfer the prototype into an industrial application.

Paper Details

Date Published: 18 May 2009
PDF: 8 pages
Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, 73621A (18 May 2009); doi: 10.1117/12.821443
Show Author Affiliations
Martin H. Schulze, Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren (Germany)
Henning Heuer, Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren (Germany)
Martin Küttner, Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren (Germany)


Published in SPIE Proceedings Vol. 7362:
Smart Sensors, Actuators, and MEMS IV
Ulrich Schmid, Editor(s)

© SPIE. Terms of Use
Back to Top