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Proceedings Paper

Packaging of MEMS microphones
Author(s): Gregor Feiertag; Matthias Winter; Anton Leidl
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Paper Abstract

To miniaturize MEMS microphones we have developed a microphone package using flip chip technology instead of chip and wire bonding. In this new packaging technology MEMS and ASIC are flip chip bonded on a ceramic substrate. The package is sealed by a laminated polymer foil and by a metal layer. The sound port is on the bottom side in the ceramic substrate. In this paper the packaging technology is explained in detail and results of electro-acoustic characterization and reliability testing are presented. We will also explain the way which has led us from the packaging of Surface Acoustic Wave (SAW) components to the packaging of MEMS microphones.

Paper Details

Date Published: 18 May 2009
PDF: 8 pages
Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, 73620D (18 May 2009); doi: 10.1117/12.821186
Show Author Affiliations
Gregor Feiertag, EPCOS AG (Germany)
Matthias Winter, Univ. des Saarlandes (Germany)
EPCOS AG (Germany)
Anton Leidl, EPCOS AG (Germany)


Published in SPIE Proceedings Vol. 7362:
Smart Sensors, Actuators, and MEMS IV
Ulrich Schmid, Editor(s)

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