Share Email Print
cover

Proceedings Paper

New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level
Author(s): Ingrid De Wolf; Jeroen De Coster; Vladimir Cherman; Piotr Czarnecki; Stanislaw Kalicinski; Olalla Varela Pedreira; Sandeep Sangameswaran; Kris Vanstreels
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In this paper various non-standard methods and instruments for the functional, yield and reliability analysis of MEMS are discussed. Most of these methods are based on existing instruments, involving electrical, optical or mechanical measurements. We present either alternative applications of existing techniques, new methodology for data extraction, or adaptation/automation of the techniques for automatic chip or wafer level measurements.

Paper Details

Date Published: 19 May 2009
PDF: 9 pages
Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, 73620N (19 May 2009); doi: 10.1117/12.820977
Show Author Affiliations
Ingrid De Wolf, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
Jeroen De Coster, IMEC (Belgium)
Vladimir Cherman, IMEC (Belgium)
Piotr Czarnecki, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
Stanislaw Kalicinski, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
Olalla Varela Pedreira, IMEC (Belgium)
Sandeep Sangameswaran, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
Kris Vanstreels, IMEC (Belgium)


Published in SPIE Proceedings Vol. 7362:
Smart Sensors, Actuators, and MEMS IV
Ulrich Schmid, Editor(s)

© SPIE. Terms of Use
Back to Top