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Proceedings Paper

Implementation of ion-beam techniques in microsystems manufacturing: opportunities in cell biology
Author(s): E. M. Campo; M. J. Lopez-Martinez; E. Fernández; J.. Esteve; J. A. Plaza
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Paper Abstract

Micromachining techniques are proposed to mass-manufacture innovative silicon oxide micropipettes and conventional boron-silicate pipettes with highly customized tips to address increasingly demanding cell handling procedures. Cell handling has become a crucial procedure in cell biology, especially in nuclear transfer, DNA injection, and in assisted reproductive techniques. Most pipette manufacturing procedures involve tedious artisanal methods prone to failure and with limited functionality. We expect high tip customization to have a large impact in current and future cell manipulation, paving the way for augmented functionality. Although proper biocompatibility assessments remain to be explored, initial pierced embryos are seen to continue their division procedure up to at least 24 hours. The continued cellular division is a good sign of biocompatibility. These results suggest that residual chemical agents or gallium ions injected during milling could be harmless to life development. We conclude that we have produced a novel technique combining microfabrication and Focus Ion Beam processes with great potential for industrial applications.

Paper Details

Date Published: 22 May 2009
PDF: 9 pages
Proc. SPIE 7378, Scanning Microscopy 2009, 73780K (22 May 2009); doi: 10.1117/12.820667
Show Author Affiliations
E. M. Campo, Ctr. Nacional de Microelectrónica (Spain)
M. J. Lopez-Martinez, Ctr. Nacional de Microelectrónica (Spain)
E. Fernández, Univ. Autònoma de Barcelona (Spain)
J.. Esteve, Ctr. Nacional de Microelectrónica (Spain)
J. A. Plaza, Ctr. Nacional de Microelectrónica (Spain)

Published in SPIE Proceedings Vol. 7378:
Scanning Microscopy 2009
Michael T. Postek; Michael T. Postek; Michael T. Postek; Dale E. Newbury; Dale E. Newbury; Dale E. Newbury; S. Frank Platek; S. Frank Platek; S. Frank Platek; David C. Joy; David C. Joy; David C. Joy, Editor(s)

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