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Proceedings Paper

Development of polyimide-based flexible tactile sensing module integrated with strain gauges & flexible flat cable
Author(s): Kunnyun Kim; Kang Ryeol Lee; Won Hyo Kim; Kwang-Bum Park; Tae-Hyung Kim; James Jungho Pak
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Paper Abstract

A flexible tactile sensing module with NiCr strain gauges as sensing elements was fabricated by polymer MEMS technology using polyimide materials where the one was the photo-definable polyimide precursor and the other was nonphoto- definable. The unit sensor cell size of 32×32 tactile sensor array was 1mm × 1mm cell and its overall size was 5.5cm × 6.5cm. Especially, both the tactile sensor arrays and the pluggable terminals as flexible flat cable were fabricated on the same polymer substrate easily to be connected the sensor array with a PCB board. The fabricated tactile sensing module was measured continuously in the normal force range of 0~1N with tactile sensor evaluation system. The value of resistance was relatively linear with normal force in the overall range of 0~1N. However, the variation of resistance was decreased by more than 0.6N. The variation rate of resistance was 2.0%/N in the range of 0~0.6N and 1.5%/N in the range of 0.6~1N. Image display was identified corresponding by distribution of applied force. The flexibility of the sensing module was adequate to be placed on any curved surface as a cylinder.

Paper Details

Date Published: 30 December 2008
PDF: 9 pages
Proc. SPIE 7269, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV, 72690P (30 December 2008); doi: 10.1117/12.820053
Show Author Affiliations
Kunnyun Kim, Korea Electronics Technology Institute (Korea, Republic of)
Kang Ryeol Lee, Korea Electronics Technology Institute (Korea, Republic of)
Won Hyo Kim, Korea Electronics Technology Institute (Korea, Republic of)
Kwang-Bum Park, Korea Electronics Technology Institute (Korea, Republic of)
Tae-Hyung Kim, Korea Electronics Technology Institute (Korea, Republic of)
James Jungho Pak, Korea Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 7269:
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV
Jung-Chih Chiao; Alex J. Hariz; David V. Thiel; Changyi Yang, Editor(s)

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