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Proceedings Paper

A wireless flexible temperature and tactile sensing array for robot applications
Author(s): Y.-J. Yang; M.-Y. Cheng; C.-L. Lin; C.-M. Tsao; S.-A. Yang; W.-P. Shih; F.-Y. Chang; K.-C. Fan
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Paper Abstract

The development of a flexible 8x8 temperature and tactile sensing array, which will serve as the artificial skin for robot applications, is presented in this work. Pressure conductive rubber is employed as the tactile sensing material, and discrete temperature sensor chips are employed as the temperature sensing cells. Small disks of pressure conductive rubber are bonded on pre-defined interdigital copper electrode pairs which are patterned on a flexible copper-PI substrate which is fabricated by micromachining techniques. This approach can effectively reduce the crosstalk between each tactile sensing element. The mechanical and electrical properties of tactile sensing elements are measured. Also, scanning circuits are designed and implemented. The temperature and tactile sensing elements are heterogeneously integrated on the flexible substrate. By using the integrated 8x8 sensing arrays, temperature and tactile images induced by the heaters/stamps of different shapes have been successfully measured. Radio-frequency (RF) wireless modules are also developed and integrated on the skin system.

Paper Details

Date Published: 31 December 2008
PDF: 6 pages
Proc. SPIE 7130, Fourth International Symposium on Precision Mechanical Measurements, 71300Y (31 December 2008); doi: 10.1117/12.819571
Show Author Affiliations
Y.-J. Yang, National Taiwan Univ. (Taiwan)
M.-Y. Cheng, National Taiwan Univ. (Taiwan)
C.-L. Lin, National Taiwan Univ. (Taiwan)
C.-M. Tsao, National Taiwan Univ. (Taiwan)
S.-A. Yang, National Taiwan Univ. (Taiwan)
W.-P. Shih, National Taiwan Univ. (Taiwan)
F.-Y. Chang, Industrial Technology Research Institute (Taiwan)
K.-C. Fan, National Taiwan Univ. (Taiwan)


Published in SPIE Proceedings Vol. 7130:
Fourth International Symposium on Precision Mechanical Measurements
Yetai Fei; Kuang-Chao Fan; Rongsheng Lu, Editor(s)

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