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Proceedings Paper

17 µm microbolometer FPA technology at BAE Systems
Author(s): Richard Blackwell; Daniel Lacroix; Tuyet Bach; Jonathan Ishii; Sandra Hyland; Thomas Dumas; Scott Carpenter; Sherman Chan; Balwinder Sujlana
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Paper Abstract

BAE Systems has continued to advance its 17 μm pitch LWIR 640 x 480 microbolometer technology with improvements in pixel performance and initial production for several emerging products. In addition, we have developed short time constant variants of our standard pixel design to support applications requiring short thermal time constants. The technology is expanding to include a 1024x768 format megapixel FPA to support higher resolution applications.

Paper Details

Date Published: 6 May 2009
PDF: 6 pages
Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980P (6 May 2009); doi: 10.1117/12.819389
Show Author Affiliations
Richard Blackwell, BAE Systems (United States)
Daniel Lacroix, BAE Systems (United States)
Tuyet Bach, BAE Systems (United States)
Jonathan Ishii, BAE Systems (United States)
Sandra Hyland, BAE Systems (United States)
Thomas Dumas, BAE Systems (United States)
Scott Carpenter, BAE Systems (United States)
Sherman Chan, BAE Systems (United States)
Balwinder Sujlana, BAE Systems (United States)


Published in SPIE Proceedings Vol. 7298:
Infrared Technology and Applications XXXV
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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