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Proceedings Paper

80 x 60 element thermoelectric infrared focal plane array for high-volume commercial use
Author(s): David Kryskowski; Justin Renken
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Paper Abstract

This paper presents an 80 x 60 element thermoelectric infrared focal plane array that provides high responsivity and a low cost/high volume potential. The device has been designed to have a responsivity of 2100 V/W. The overall chip size is 12.2mm x 9.3mm with a 10.4mm x 7.8mm imaging area. Each detector consists of three pairs of p-n polysilicon thermocouples with external dimensions of 130um x 130um and an internal resistance of 90k ohms. The thermal time constant for this device is ≈ 16ms. Compatible with standard CMOS processes this bulk micromachined focal plane array delivers near microbolometer performance making very low cost infrared cameras economically feasible.

Paper Details

Date Published: 6 May 2009
PDF: 12 pages
Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980N (6 May 2009); doi: 10.1117/12.819061
Show Author Affiliations
David Kryskowski, Ann Arbor Sensor Systems, LLC (United States)
Justin Renken, Ann Arbor Sensor Systems, LLC (United States)


Published in SPIE Proceedings Vol. 7298:
Infrared Technology and Applications XXXV
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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