Share Email Print
cover

Proceedings Paper

A 160 x 120 pixel uncooled TEC-less infrared radiation focal plane array on a standard ceramic package
Author(s): Hideyuki Funaki; Hiroto Honda; Ikuo Fujiwara; Hitoshi Yagi; Kouichi Ishii; Keita Sasaki
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We have developed a 32 μm pitch and 160 × 120 pixel uncooled infrared radiation focal plane array (IRFPA) on SOI by 0.35 μm CMOS technology and bulk-micromachining. For IR detection, we use silicon single crystal series p-n junctions which can realize high uniformity of temperature coefficient and low voltage drift. We have also developed a low-noise CMOS readout circuit on the same SOI which can calibrate the substrate temperature variation in every frame period, comparing two types of pixels, a bulk-micromachined infrared detection pixel and a non-micromachined reference pixel. Then the FPA requires no thermo-electric cooler (TEC) and is mounted on a low-cost standard ceramic package for the consumer products market.

Paper Details

Date Published: 7 May 2009
PDF: 9 pages
Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980W (7 May 2009); doi: 10.1117/12.819034
Show Author Affiliations
Hideyuki Funaki, Toshiba Corp. (Japan)
Hiroto Honda, Toshiba Corp. (Japan)
Ikuo Fujiwara, Toshiba Corp. (Japan)
Hitoshi Yagi, Toshiba Corp. (Japan)
Kouichi Ishii, Toshiba Corp. (Japan)
Keita Sasaki, Toshiba Corp. (Japan)


Published in SPIE Proceedings Vol. 7298:
Infrared Technology and Applications XXXV
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

© SPIE. Terms of Use
Back to Top