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Proceedings Paper

Next-generation PIR security sensors: concept testing and evaluation
Author(s): Kevin C. Liddiard
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Paper Abstract

In previous presentations to this SPIE forum a new technology was outlined aimed at replacing pyroelectric sensors with resistance microbolometer MOEMS-based sensors capable of vastly superior performance. The technology can be implemented as either a PCB replacement to current sensors, giving extended detection range and ability to sense slow temperature change, or a 'smart' sensor with further performance enhancements and imaging capability. This paper reports the results of new laboratory and field tests of a laboratory prototype sensor and extrapolates these results to performance of production sensors. In particular, results are presented for NETD, detection range for human targets and detection of simulated electrical faults and developing fires. Previous results were reported for FPA operated without evacuation and using a low cost plastic Fresnel lens. However with wafer level packaging now becoming widely available in MEMS and CMOS foundries, much high performance can be achieved, opening up many additional applications. Performance of new FPAs designed for vacuum packaging is highlighted.

Paper Details

Date Published: 6 May 2009
PDF: 8 pages
Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980X (6 May 2009); doi: 10.1117/12.818422
Show Author Affiliations
Kevin C. Liddiard, Electro-optic Sensor Design (Australia)


Published in SPIE Proceedings Vol. 7298:
Infrared Technology and Applications XXXV
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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