Share Email Print
cover

Proceedings Paper

Novel readout circuit architecture realizing TEC-less operation for SOI diode uncooled IRFPA
Author(s): Takahiro Ohnakado; Masashi Ueno; Yasuaki Ohta; Yasuhiro Kosasayama; Hisatoshi Hata; Takaki Sugino; Takanori Ohno; Keisuke Kama; Masahiro Tsugai; Hiroshi Fukumoto
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

We have developed a novel readout circuit architecture realizing a TEC-less (Thermo-Electric Cooler) operation for an SOI diode uncooled infrared focal plane array (IRFPA). Through the fabrication of an SOI diode uncooled 320 x 240 IRFPA adopting the readout circuit architecture with our existing 25μm pixel-pitch technology, we demonstrate that the variation of the output DC level of the pixels is successfully suppressed in environmental temperatures from -10°C to 50°C. The developed TEC-less technology greatly enhances the ability of the SOI diode uncooled IRFPA, which inherently possesses excellent uniformity and low noise features.

Paper Details

Date Published: 7 May 2009
PDF: 10 pages
Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980V (7 May 2009); doi: 10.1117/12.818418
Show Author Affiliations
Takahiro Ohnakado, Mitsubishi Electric Corp. (Japan)
Masashi Ueno, Mitsubishi Electric Corp. (Japan)
Yasuaki Ohta, Mitsubishi Electric Corp. (Japan)
Yasuhiro Kosasayama, Mitsubishi Electric Corp. (Japan)
Hisatoshi Hata, Mitsubishi Electric Corp. (Japan)
Takaki Sugino, Mitsubishi Electric Corp. (Japan)
Takanori Ohno, Mitsubishi Electric Corp. (Japan)
Keisuke Kama, Mitsubishi Electric Corp. (Japan)
Masahiro Tsugai, Mitsubishi Electric Corp. (Japan)
Hiroshi Fukumoto, Mitsubishi Electric Corp. (Japan)


Published in SPIE Proceedings Vol. 7298:
Infrared Technology and Applications XXXV
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

© SPIE. Terms of Use
Back to Top