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Proceedings Paper

REBL nanowriter: Reflective Electron Beam Lithography
Author(s): Paul Petric; Chris Bevis; Alan Brodie; Allen Carroll; Anthony Cheung; Luca Grella; Mark McCord; Henry Percy; Keith Standiford; Marek Zywno
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Paper Abstract

REBL (Reflective Electron Beam Lithography) is being developed for high throughput electron beam direct write maskless lithography. The system is specifically targeting 5 to 7 wafer levels per hour throughput on average at the 45 nm node, with extendibility to the 32 nm node and beyond. REBL incorporates a number of novel technologies to generate and expose lithographic patterns at estimated throughputs considerably higher than electron beam lithography has been able to achieve as yet. A patented reflective electron optic concept enables the unique approach utilized for the Digital Pattern Generator (DPG). The DPG is a CMOS ASIC chip with an array of small, independently controllable cells or pixels, which act as an array of electron mirrors. In this way, the system is capable of generating the pattern to be written using massively parallel exposure by ~1 million beams at extremely high data rates (~ 1Tbps). A rotary stage concept using a rotating platen carrying multiple wafers optimizes the writing strategy of the DPG to achieve the capability of high throughput for sparse pattern wafer levels. The exposure method utilized by the DPG was emulated on a Vistec VB-6 in order to validate the gray level exposure method used in REBL. Results of these exposure tests are discussed.

Paper Details

Date Published: 17 March 2009
PDF: 15 pages
Proc. SPIE 7271, Alternative Lithographic Technologies, 727107 (17 March 2009); doi: 10.1117/12.817319
Show Author Affiliations
Paul Petric, KLA-Tencor Corp. (United States)
Chris Bevis, KLA-Tencor Corp. (United States)
Alan Brodie, KLA-Tencor Corp. (United States)
Allen Carroll, KLA-Tencor Corp. (United States)
Anthony Cheung, KLA-Tencor Corp. (United States)
Luca Grella, KLA-Tencor Corp. (United States)
Mark McCord, KLA-Tencor Corp. (United States)
Henry Percy, KLA-Tencor Corp. (United States)
Keith Standiford, KLA-Tencor Corp. (United States)
Marek Zywno, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7271:
Alternative Lithographic Technologies
Frank M. Schellenberg; Bruno M. La Fontaine, Editor(s)

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