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Proceedings Paper

Reflection control for immersion lithography: a single organic antireflectant over high-reflective substrates for double patterning
Author(s): Sabrina Wong; Jeong Yun Yu; Sue Ryeon Kim; Mike Mori; Amy Kwok; Kathleen M. O'Connell; George Barclay; Ki Lyoung Lee; Sung Koo Lee; Cheol Kyu Bok
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Paper Abstract

When patterning critical layers at hyper NA, a multilayer antireflectant system is required in order to control complex reflectivity resulting from various incident angles. Multilayer antireflectants typically consist of an organic antireflectant and inorganic substrates. However, there are still some applications which need a single organic antireflectant over high reflective substrates. A 2P2E application in double patterning is one of them. Even though the pitch for double patterning is relatively loose, the reflectivity control is still challenging in terms of profiles and overall process window. The optical constants and thickness of antireflectants should be well optimized depending on applications. We have investigated several organic antireflectants for a single antireflectant over high reflective substrates. The organic films differ in terms of n, k, thickness to cover both the 1st minimum and the 2nd minimum applications. The overall patterning performance including profiles and process window has been evaluated. ASML 1900i was used to perform lithography. Simulation was performed using ProlithTM software.

Paper Details

Date Published: 10 April 2009
PDF: 8 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727318 (10 April 2009); doi: 10.1117/12.816448
Show Author Affiliations
Sabrina Wong, Rohm and Haas Electronic Materials LLC (United States)
Jeong Yun Yu, Rohm and Haas Electronic Materials LLC (United States)
Sue Ryeon Kim, Rohm and Haas Electronic Materials LLC (United States)
Mike Mori, Rohm and Haas Electronic Materials LLC (United States)
Amy Kwok, Rohm and Haas Electronic Materials LLC (United States)
Kathleen M. O'Connell, Rohm and Haas Electronic Materials LLC (United States)
George Barclay, Rohm and Haas Electronic Materials LLC (United States)
Ki Lyoung Lee, Hynix Semiconductor Inc. (Korea, Republic of)
Sung Koo Lee, Hynix Semiconductor Inc. (United States)
Cheol Kyu Bok, Hynix Semiconductor Inc. (United States)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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