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Proceedings Paper

Radiation sensitive developable bottom anti-reflective coatings (DBARC): recent results
Author(s): Francis M. Houlihan; Alberto Dioses; Takanori Kudo; Meng Li; Lin Zhang; Sumathy Vasanthan; Srinivasan Chakrapani; Deepa Parthasarathy; Charito Antonio; Edward Ng; Ping-Hung Lu; Mark Neisser; Munirathna Padmanaban
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Paper Abstract

Second generation, radiation sensitive, developable 193 Bottom Antireflective coatings (DBARCs) are made solvent resistant through a crosslinking mechanism activated during post apply bake (PAB) that is reversible by acid catalyzed reaction upon exposure of the DBARC/resist stack. This allows coating the resists on the DBARC, after PAB, without dissolution of the antireflective coating. This DBARC approach avoids the plasma etch breakthrough needed for conventional bottom antireflective coatings which are irreversibly crosslinked, while maintaining excellent reflectivity control, typically lower than 1% on bare Si. We will give an update on the performance our latest 193 nm DBARC prototype materials used with different conventional alicyclic based 193 nm resists. For instance, using a binary mask with conventional illumination several of our prototype DBARC formulations were able to resolve 120 nm trench features with a 250 nm pitch.

Paper Details

Date Published: 1 April 2009
PDF: 8 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727316 (1 April 2009); doi: 10.1117/12.816375
Show Author Affiliations
Francis M. Houlihan, AZ Electronic Materials (United States)
Alberto Dioses, AZ Electronic Materials (United States)
Takanori Kudo, AZ Electronic Materials (United States)
Meng Li, AZ Electronic Materials (United States)
Lin Zhang, AZ Electronic Materials (United States)
Sumathy Vasanthan, AZ Electronic Materials (United States)
Srinivasan Chakrapani, AZ Electronic Materials (United States)
Deepa Parthasarathy, AZ Electronic Materials (United States)
Charito Antonio, AZ Electronic Materials (United States)
Edward Ng, AZ Electronic Materials (United States)
Ping-Hung Lu, AZ Electronic Materials (United States)
Mark Neisser, AZ Electronic Materials (United States)
Munirathna Padmanaban, AZ Electronic Materials (United States)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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