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Proceedings Paper

0.30k1 CH delineation with novel image reversal materials
Author(s): J. Hatakeyama; K. Katayama; T. Yoshihara; Y. Kawai; T. Ishihara
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Paper Abstract

Resolution enhancement by novel image reversal (RENOIR) process and materials are studied for shrinkage of hole size and pitch. The process approach is based on formation of pillar pattern and its conversion to hole pattern with wet development (Fig.1). Fine pillar arrays were imaged by combination of high-resolution positive tone resist and X-Y double line exposure with hyper NA immersion lithography. To achieve the reversal characteristics, we have developed the novel resist material, which becomes of solvent insoluble and developer soluble after pillar patterning. The material realizes the solubility switch just with hard bake treatment. Reversal film material is coated over the pillar patterns, and subsequent development process converts pillars into hole patterns. 30nm size 96nm pitch hole was delineated with 150nm DoF and 10% exposure latitude by 1.2NA immersion exposure.

Paper Details

Date Published: 1 April 2009
PDF: 9 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72730L (1 April 2009); doi: 10.1117/12.816084
Show Author Affiliations
J. Hatakeyama, Shin-Etsu Chemical Co., Ltd. (Japan)
K. Katayama, Shin-Etsu Chemical Co., Ltd. (Japan)
T. Yoshihara, Shin-Etsu Chemical Co., Ltd. (Japan)
Y. Kawai, Shin-Etsu Chemical Co., Ltd. (Japan)
T. Ishihara, Shin-Etsu Chemical Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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