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Proceedings Paper

Wireless impedance device for electromechanical impedance sensing and low-frequency vibration data acquisition
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Paper Abstract

This paper presents recent developments in an extremely compact, wireless impedance sensor node for combined use with both impedance method and low-frequency vibrational data acquisition. The sensor node, referred to as the WID3 (Wireless Impedance Device) integrates several components, including an impedance chip, a microcontroller for local computing, telemetry for wireless data transmission, multiplexers for managing up to seven piezoelectric transducers per node, energy storage mediums, and several triggering options into one package to truly realize a self-contained wireless active-sensor node for SHM applications. Furthermore, we recently extended the capability of this device by implementing low-frequency A/D and D/A converters so that the same device can measure low-frequency vibration data. The WID3 requires less than 60 mW of power to operate and is designed for the mobile-agent based wireless sensing network. The performance of this miniaturized device is compared to our previous results and its capabilities are demonstrated.

Paper Details

Date Published: 30 March 2009
PDF: 12 pages
Proc. SPIE 7292, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009, 729228 (30 March 2009); doi: 10.1117/12.815534
Show Author Affiliations
Stuart G. Taylor, Los Alamos National Lab. (United States)
Kevin M. Farinholt, Los Alamos National Lab. (United States)
Gyuhae Park, Los Alamos National Lab. (United States)
Charles R. Farrar, Los Alamos National Lab. (United States)
Eric B. Flynn, Univ. of California, San Diego (United States)
David L. Mascarenas, Univ. of California, San Diego (United States)
Michael D. Todd, Univ. of California, San Diego (United States)


Published in SPIE Proceedings Vol. 7292:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009
Masayoshi Tomizuka, Editor(s)

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