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Proceedings Paper

Enhanced layout optimization of sub-45nm standard: memory cells and its effects
Author(s): Seung Weon Paek; Dae Hyun Jang; Joo Hyun Park; Naya Ha; Byung-Moo Kim; Hyo Sig Won; Kyu-Myung Choi; Kuang-Kuo Lin; Simon Klaver; Shobhit Malik; Michiel Oostindie; Frank Driessen
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Paper Abstract

Automatic layout optimization is becoming an important component of the DfM work flow, as the number of recommended rules and the increasing complexity of trade-offs between them makes manual optimization increasingly difficult and time-consuming. Automation is rapidly becoming the best consistent way to get quantifiable DfM improvements, with their inherent yield and performance benefits for standard cells and memory blocks. Takumi autofixer optimization of Common Platform layouts resulted in improved parametric tolerance and improved DfM metrics, while the cell architecture (size and routability) and the electrical characteristics (speed/power) of the layouts remained intact. Optimization was performed on both GDS-style layouts for standard cells, and on CDBA (Cadence Data Base Architecture)-style layout for memory blocks. This paper will show how trade-offs between various DfM requirements (CAA, recommended rules, and litho) were implemented, and how optimization for memories generated by a compiler was accomplished. Results from this optimization work were verified on 45nm design by model and rule based DfM checking and by wafer yields.

Paper Details

Date Published: 12 March 2009
PDF: 9 pages
Proc. SPIE 7275, Design for Manufacturability through Design-Process Integration III, 72751M (12 March 2009); doi: 10.1117/12.815413
Show Author Affiliations
Seung Weon Paek, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Dae Hyun Jang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Joo Hyun Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Naya Ha, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Byung-Moo Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Hyo Sig Won, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Kyu-Myung Choi, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Kuang-Kuo Lin, Chartered Semiconductor Manufacturing, Inc. (United States)
Simon Klaver, Takumi Technology Corp. (United States)
Shobhit Malik, Takumi Technology Corp. (United States)
Michiel Oostindie, Takumi Technology Corp. (United States)
Frank Driessen, Takumi Technology Corp. (United States)


Published in SPIE Proceedings Vol. 7275:
Design for Manufacturability through Design-Process Integration III
Vivek K. Singh; Michael L. Rieger, Editor(s)

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