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Proceedings Paper

Optical fiber packaging for MEMS interfacing
Author(s): Jose Mireles; Miguel A. Garcia; Roberto C. Ambrosio; Ernest J. Garcia; Wilfrido Calleja; Claudia Reyes
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Paper Abstract

An investigation study concerning positioning, alignment, bonding and packaging of optical fibers for interfacing with optical MEMS devices is being reviewed in this paper. The study includes a review of techniques and critical issues for optical fiber positioning, alignment, bonding, optical improvements, and coupling and interfacing through micro-lenses and waveguides. Also, we present a packaging design structure for hermetic sealing of optical MEMS devices requiring interfacing through optical fibers which considers aspects such as processes, assemble schemes and bonding techniques for Optical Fibers, which are briefly reviewed in this work. This packaging design considers the following conditions: hermeticity of the MEMS devices, optical fiber and MEMS die alignment and positioning, assembly process, and Simachined fixturing design for final assembly and positioning.

Paper Details

Date Published: 23 February 2009
PDF: 12 pages
Proc. SPIE 7204, Micromachining and Microfabrication Process Technology XIV, 720405 (23 February 2009); doi: 10.1117/12.815170
Show Author Affiliations
Jose Mireles, Univ. Autónoma de Ciudad Juárez (Mexico)
Miguel A. Garcia, Univ. Autónoma de Ciudad Juárez (Mexico)
Roberto C. Ambrosio, Univ. Autónoma de Ciudad Juárez (Mexico)
Ernest J. Garcia, Sandia National Labs. (United States)
Wilfrido Calleja, Instituto Nacional de Astrofísica, Óptica y Electrónica (Mexico)
Claudia Reyes, Instituto Nacional de Astrofísica, Óptica y Electrónica (Mexico)


Published in SPIE Proceedings Vol. 7204:
Micromachining and Microfabrication Process Technology XIV
Mary-Ann Maher; Jung-Chih Chiao; Paul J. Resnick, Editor(s)

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