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Proceedings Paper

Double imaging with resist freezing in a vapor reaction chamber
Author(s): Ralph R. Dammel; Yusuke Takano; Richard Collett; David J. Abdallah
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Paper Abstract

Cost-effective approaches to double patterning are currently an area of intense interest. This paper describes an update on the progress of AZ's Vapor Reaction Chamber (VRC) freeze approach to double patterning. Swift integration of the VRC process will depend on whether or not a commercial prime chamber can function as a VRC chamber without modifications. Procedures for testing this were developed and applied to a lab VRC and 2 AHD modules. Results demonstrate that for the 8in ADH the across wafer freeze uniformity is within the experimental error of the FT-IR measurements used to evaluate the process, but that some slight variation was seen for the 12in ADH. In addition, progress has been made in improving double imaging profiles over earlier work which used the same resist in both exposures on ArF 1C5D substrates. This work looked at the benefits of using different substrates, establish a suitable resist for each exposure, and using substrate treatments to improve profiles.

Paper Details

Date Published: 1 April 2009
PDF: 8 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72731F (1 April 2009); doi: 10.1117/12.815138
Show Author Affiliations
Ralph R. Dammel, AZ Electronic Materials (United States)
Yusuke Takano, AZ Electronic Materials (United States)
Richard Collett, AZ Electronic Materials (United States)
David J. Abdallah, AZ Electronic Materials (United States)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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