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Proceedings Paper

Evaluation of a new metrology technique to support the needs of accuracy, precision, speed, and sophistication in near-future lithography
Author(s): Chih-Ming Ke; Jimmy Hu; Willie Wang; Jacky Huang; H. L. Chung; C. R. Liang; Victor Shih; H. H. Liu; H. J. Lee; John Lin; Y. D. Fan; Kaustuve Bhattacharyya; Maurits van der Schaar; Noelle Wright; Kiwi Yuan; Vivien Wang; Cathy Wang; Spencer Lin; Mir Shahrjerdy; Andreas Fuchs; Karel van der Mast
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Paper Abstract

A new metrology technique is being evaluated to address the need for accuracy, precision, speed and sophistication in metrology in near-future lithography. Attention must be paid to these stringent requirements as the current metrology capabilities may not be sufficient to support these near future needs. Sub-nanometer requirements in accuracy and precision along with the demand for increase in sampling triggers the need for such evaluation. This is a continuation of the work published at SPIE Asia conference, 2008. In this technical presentation the authors would like to continue on reporting the newest results from this evaluation of such technology, a new scatterometry based platform under development at ASML, which has the potential to support the future needs. Extensive data collection and tests are ongoing for both CD and overlay. Previous data showed overlay performance on production layers [1] that meet 22 nm node requirements. The new data discussed in this presentation is from further investigation on more process robust overlay targets and smaller target designs. Initial CD evaluation data is also discussed.

Paper Details

Date Published: 23 March 2009
PDF: 7 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72720A (23 March 2009); doi: 10.1117/12.814860
Show Author Affiliations
Chih-Ming Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Jimmy Hu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Willie Wang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Jacky Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. L. Chung, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
C. R. Liang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Victor Shih, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. H. Liu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. J. Lee, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
John Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Y. D. Fan, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands)
Maurits van der Schaar, ASML Netherlands B.V. (Netherlands)
Noelle Wright, ASML Netherlands B.V. (Netherlands)
Kiwi Yuan, ASML Netherlands B.V. (Netherlands)
Vivien Wang, ASML Netherlands B.V. (Netherlands)
Cathy Wang, ASML Netherlands B.V. (Netherlands)
Spencer Lin, ASML Netherlands B.V. (Netherlands)
Mir Shahrjerdy, ASML Netherlands B.V. (Netherlands)
Andreas Fuchs, ASML Netherlands B.V. (Netherlands)
Karel van der Mast, ASML Netherlands B.V. (Netherlands)


Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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