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Proceedings Paper

High throughput measurement techniques for wafer level yield inspection of MEMS devices
Author(s): O. Varela Pedreira; T. Lauwagie; J. De Coster; L. Haspeslagh; A. Witvrouw; I. De Wolf
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Paper Abstract

This paper presents two distinct measurement systems that were custom-built for the parametric and functional yield inspection of MEMS devices on wafer-level. Throughput as well as accuracy was optimized by using automatic feature detection and data segmentation algorithms. Inaccuracies in stage positioning during scanning are compensated for by a grid detection algorithm. The analysis of the measurement data is performed in parallel with the ongoing measurements. The data analysis includes the detection, parameter extraction, analysis of failures or damage of a single device and the final stitching of the results in order to obtain a visual mapping of the measured arrays. The performance of both systems has been demonstrated using arrays of micromirrors as test vehicles.

Paper Details

Date Published: 3 October 2008
PDF: 11 pages
Proc. SPIE 7155, Ninth International Symposium on Laser Metrology, 71550M (3 October 2008); doi: 10.1117/12.814724
Show Author Affiliations
O. Varela Pedreira, IMEC (Belgium)
T. Lauwagie, IMEC (Belgium)
J. De Coster, IMEC (Belgium)
L. Haspeslagh, IMEC (Belgium)
A. Witvrouw, IMEC (Belgium)
I. De Wolf, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)


Published in SPIE Proceedings Vol. 7155:
Ninth International Symposium on Laser Metrology

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