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Proceedings Paper

Source optimization for three-dimensional image designs through film stacks
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Paper Abstract

In this paper, we will outline the approach for optimizing the illumination conditions to print three-dimensional images in resist stacks of varying sensitivity in a single exposure. The algorithmic approach for acheiving both optimal common and weakest window is presented. Results will be presented which demonstrate the ability of the technique to create threedimensional structures. The performance of the common and weakest window formulation will be explored using this approach. Additionally, due to physical restrictions there are limitations to the type of patterns that can be printed with a single exposure in this manner, thus the abilities of such a technique will be explored.

Paper Details

Date Published: 16 March 2009
PDF: 12 pages
Proc. SPIE 7274, Optical Microlithography XXII, 72743D (16 March 2009); doi: 10.1117/12.814700
Show Author Affiliations
David O. S. Melville, IBM Thomas J. Watson Research Ctr. (United States)
Alan E. Rosenbluth, IBM Thomas J. Watson Research Ctr. (United States)
Kehan Tian, IBM Semiconductor Research and Development Ctr. (United States)
Dario Goldfarb, IBM Thomas J. Watson Research Ctr. (United States)
Stefan Harrer, IBM Research at Albany NanoTech (United States)
Matthew Colburn, IBM Research at Albany NanoTech (United States)


Published in SPIE Proceedings Vol. 7274:
Optical Microlithography XXII
Harry J. Levinson; Mircea V. Dusa, Editor(s)

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