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Proceedings Paper

Product-driven material characterization for improved scatterometry time-to-solution
Author(s): Alok Vaid; Carsten Hartig; Matthew Sendelbach; Cornel Bozdog; Hyang Kyun Kim; Michael Sendler; Yoel Cohen; Victor Kucherov; Boaz Brill; Stanislav Stepanov
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Paper Abstract

This paper discusses a novel methodology of material characterization that directly utilizes the scatterometry targets on the product wafer to determine the optical properties (n&k) of various constituent materials. Characterization of optical constants, or dispersions, is one of the first steps of scatterometry metrology implementation. A significant benefit of this new technique is faster time-to-solution, since neither multiple single-film depositions nor multi-film depositions on blanket/product wafers are needed, making obsolete a previously required-but very time-consuming-step in the scatterometry setup. We present the basic elements of this revolutionary method, describe its functionality as currently implemented, and contrast/compare results obtained by traditional methods of materials characterization with the new method. The paper covers scatterometry results from key enabling metrology applications, like high-k metal gate (postetch and post-litho) and Metal 2 level post-etch, to explore the performance of this new material characterization approach. CDSEM was used to verify the accuracy of scatterometry solutions. Furthermore, Total Measurement Uncertainty (TMU) analysis assisted in the interpretation of correlation data, and shows that the new technique provides measurement accuracy results equivalent to, and sometimes better than, traditional extraction techniques.

Paper Details

Date Published: 23 March 2009
PDF: 12 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72720V (23 March 2009); doi: 10.1117/12.814380
Show Author Affiliations
Alok Vaid, Advanced Micro Devices, Inc. (United States)
Carsten Hartig, AMD LLC & Co. KG (Germany)
Matthew Sendelbach, IBM Corp. (United States)
Cornel Bozdog, Nova Measuring Instruments Inc. (United States)
Hyang Kyun Kim, Nova Measuring Instruments Inc. (United States)
Michael Sendler, Nova Measuring Instruments Inc. (United States)
Yoel Cohen, Nova Measuring Instruments Ltd. (Israel)
Victor Kucherov, Nova Measuring Instruments Ltd. (Israel)
Boaz Brill, Nova Measuring Instruments Ltd. (Israel)
Stanislav Stepanov, Nova Measuring Instruments Ltd. (Israel)


Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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