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Proceedings Paper

Automated overlay recipe setup in high-volume manufacturing: improving performance, efficiency, and robustness
Author(s): Christian Sparka; Anna Golotsvan; Yosef Avrahamov; Wolfgang Sitzmann; David Tien
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Paper Abstract

As the semiconductor industry continues to drive toward smaller design nodes, overlay error budgets will continue to shrink making metrology ever more challenging. Moreover, this challenge is compounded by the need to continue to drive down costs and increase productivity, especially given the competitive and macro-economic landscape going forward. In order to satisfy these two contradicting requirements, new ways of maintaining metrology tools and recipes are needed. Traditionally, recipes are generated manually by operators or even metrology engineers, involving both tool time and engineering resources. Furthermore, the influence of individual skill levels can lead to undesirable variations and is a potential source of errors that could result in yield loss. By means of automatic recipe generation both engineering and capital equipment resources can be minimized. Implementation of an automated recipe creation process will also result in improved recipe integrity. In this study, we show a methodology of a highly automated recipe generation for overlay measurements. We will outline the benefits of such an implementation and comment on the value for all segments of the semiconductor industry as well as provide data from production fabs demonstrating these capabilities and benefits.

Paper Details

Date Published: 23 March 2009
PDF: 8 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 727232 (23 March 2009); doi: 10.1117/12.814338
Show Author Affiliations
Christian Sparka, KLA-Tencor Corp. (United States)
Anna Golotsvan, KLA-Tencor Corp. (United States)
Yosef Avrahamov, KLA-Tencor Corp. (United States)
Wolfgang Sitzmann, KLA-Tencor Corp. (United States)
David Tien, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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