Share Email Print
cover

Proceedings Paper

Effects of carbon/hardmask interactions on hardmask performance
Author(s): Charles J. Neef; Brian Smith; Chris James; Zhimin Zhu; Michael Weigand
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Interactions between the silicon hardmask and the photoresist have received considerable attention for utilization of these materials in a trilayer scheme. In contrast, the interactions between the carbon layer and the silicon hardmask have received little or no consideration. In this paper, we present the effects of these interactions on the performance of the silicon hardmask. Poor interactions were observed to result in a more hydrophilic surface and poor lithographic performance of the silicon hardmask. However, beneficial interactions between the carbon layer and the silicon hardmask resulted in a silicon film that was denser with a hydrophobic surface. The resulting denser film had a slower CF4 etch rate and produced square, clean profiles.

Paper Details

Date Published: 1 April 2009
PDF: 7 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727311 (1 April 2009); doi: 10.1117/12.814257
Show Author Affiliations
Charles J. Neef, Brewer Science, Inc. (United States)
Brian Smith, Brewer Science, Inc. (United States)
Chris James, Brewer Science, Inc. (United States)
Zhimin Zhu, Brewer Science, Inc. (United States)
Michael Weigand, Brewer Science, Inc. (United States)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

© SPIE. Terms of Use
Back to Top