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Proceedings Paper

Fabrication of metrology test structures for future technology nodes using high-resolution variable-shaped e-beam direct write
Author(s): László Szikszai; Philipp Jaschinsky; Katja Keil; Marc Hauptmann; Manfred Mört; Uwe Seifert; Christoph Hohle; Kang-Hoon Choi; Frank Thrum; Johannes Kretz; Vaeriano Ferreras Paz; Arie den Boef
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Paper Abstract

Electron beam direct write (EBDW) can be utilized for developing metrology methods for future technology nodes. Due to its advantage of high resolution and flexibility combined with suitable throughput capability, variable-shaped E-Beam lithography is the appropriate method to fabricate sub 40nm resist structures with accurately defined properties, such as critical dimension (CD), pitch, line edge roughness (LER) and line width roughness (LWR). In this study we present results of exposure experiments intended to serve as an important instrument for testing and fitting various metrology and defect density measurement methods for future technology nodes. We successfully fabricated sub 40nm gratings with varying CD, pitch, programmed defects and LER/LWR. First metrology measurements by means of optical scatterometry on these dense structures show that variation of the signal response is sufficient to detect sub 10nm fluctuations with a satisfying repeatability.

Paper Details

Date Published: 17 March 2009
PDF: 10 pages
Proc. SPIE 7271, Alternative Lithographic Technologies, 72712M (17 March 2009); doi: 10.1117/12.814181
Show Author Affiliations
László Szikszai, Fraunhofer Ctr. Nanoelectronic Technologies (Germany)
Philipp Jaschinsky, Fraunhofer Ctr. Nanoelectronic Technologies (Germany)
Katja Keil, Fraunhofer Ctr. Nanoelectronic Technologies (Germany)
Marc Hauptmann, Fraunhofer Ctr. Nanoelectronic Technologies (Germany)
Manfred Mört, Qimonda Dresden GmbH & Co. OHG (Germany)
Uwe Seifert, Qimonda Dresden GmbH & Co. OHG (Germany)
Christoph Hohle, Qimonda Dresden GmbH & Co. OHG (Germany)
Kang-Hoon Choi, Qimonda Dresden GmbH & Co. OHG (Germany)
Frank Thrum, Qimonda Dresden GmbH & Co. OHG (Germany)
Johannes Kretz, Qimonda Dresden GmbH & Co. OHG (Germany)
Vaeriano Ferreras Paz, Univ. of Stuttgart (Germany)
Arie den Boef, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 7271:
Alternative Lithographic Technologies
Frank M. Schellenberg; Bruno M. La Fontaine, Editor(s)

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