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Proceedings Paper

Development and implementation of PWQ on patterned wafer darkfield inspection systems
Author(s): Uwe Streller; Kay Wendt; Arno Wehner; Jens Goeckeritz; Markus Gahr; Martin Tuckermann; Jennifer Kopp; Monica Hellerqvist
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Paper Abstract

Process Window Qualification (PWQ) is a well-established wafer inspection technique used to qualify the design of mask sets and to characterize lithography process windows. While PWQ typically employs a broadband brightfield inspector, novel techniques for patterned wafer darkfield inspection have proven to provide sufficient sensitivity along with noise suppression benefits for lithography layers. This paper describes the introduction and implementation of PWQ on patterned wafer darkfield inspectors. An initial project characterized critical PWQ requirements on the darkfield inspector. The results showed that this new approach meets performance requirements, such as defect of interest (DOI) detection and process window characterization, as well as ease-of-use requirements such as automated setup for advanced design rule products.

Paper Details

Date Published: 23 March 2009
PDF: 9 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72723J (23 March 2009); doi: 10.1117/12.814149
Show Author Affiliations
Uwe Streller, Qimonda Dresden GmbH & Co. OHG (Germany)
Kay Wendt, Qimonda Dresden GmbH & Co. OHG (Germany)
Arno Wehner, Qimonda Dresden GmbH & Co. OHG (Germany)
Jens Goeckeritz, Qimonda Dresden GmbH & Co. OHG (Germany)
Markus Gahr, KLA-Tencor GmbH (Germany)
Martin Tuckermann, KLA-Tencor GmbH (Germany)
Jennifer Kopp, KLA-Tencor Corp. (United States)
Monica Hellerqvist, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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