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Proceedings Paper

Characteristic three-dimensional structure of resist's distribution after drying a resist solution coated on a flat substrate: analysis using the extended dynamical model of the drying process
Author(s): Hiroyuki Kagami
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Paper Abstract

We extend the former dynamical model of drying process of a resist solution coated on a flat substrate to three-dimensional one. And through numerical simulation of the extended dynamical model we clarified characteristic three-dimensional structure of resist's thickness distribution after drying. And we confirmed characteristic thickness distribution of resist thin film obtained by two-dimensional model through three-dimensional model again.

Paper Details

Date Published: 1 April 2009
PDF: 8 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727335 (1 April 2009); doi: 10.1117/12.814141
Show Author Affiliations
Hiroyuki Kagami, Nagoya College (Japan)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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