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Proceedings Paper

Organic underlayer materials with exceptionally high thermal stability
Author(s): Hwan-Sung Cheon; Kyong-Ho Yoon; Min-Soo Kim; Sung Bae Oh; Jee-Yun Song; Nataliya Tokareva; Jong-Seob Kim; Tuwon Chang
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Paper Abstract

Multilayer hardmask (MLHM) schemes have been implemented as an indispensable process for ArF lithography which continues to demand thinner photoresist films. There are many variations of MLHM and semiconductor manufacturers choose to adopt their own designs, depending on their specific needs and technical advances. The quad-layer stack consisting of photoresist, organic ARC, CVD Si hardmask, and spin-on carbon underlayer is one of them. Despite the need for wafer transporting between the spin track and CVD equipment, this scheme is attractive because it can avoid laborious elaboration of sophisticated etching chemistries for spin-on Si-ARC and carbon underlayer. One of the issues arising from the mixed film forming process is the thermal stability of carbon underlayer at high temperatures during the CVD process of the Si hardmask. Organic underlayer which shows high thermal stability is crucial for this mixed hardmask process. These types of thermally stable organic film can also be used for other applications such as the spacer patterning technique for pitch size shrinkage. In this paper, we discuss the development of organic resins with high thermal stability, their physical properties, and their lithographic behaviors in the MLHM schemes.

Paper Details

Date Published: 1 April 2009
PDF: 9 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727310 (1 April 2009); doi: 10.1117/12.814082
Show Author Affiliations
Hwan-Sung Cheon, Samsung Cheil Industries Inc. (Korea, Republic of)
Kyong-Ho Yoon, Samsung Cheil Industries Inc. (Korea, Republic of)
Min-Soo Kim, Samsung Cheil Industries Inc. (Korea, Republic of)
Sung Bae Oh, Samsung Cheil Industries Inc. (Korea, Republic of)
Jee-Yun Song, Samsung Cheil Industries Inc. (Korea, Republic of)
Nataliya Tokareva, Samsung Cheil Industries Inc. (Korea, Republic of)
Jong-Seob Kim, Samsung Cheil Industries Inc. (Korea, Republic of)
Tuwon Chang, Samsung Cheil Industries Inc. (Korea, Republic of)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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