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Proceedings Paper

Productivity improvement in the wafer backside cleaning before exposure
Author(s): S. Nishikido; T. Kitano; Y. Tokunaga; Marlene Strobl; Yu Chen Lin
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Paper Abstract

In the photolithography process, with the miniaturization of pattern size, depth of focus (D.O.F) is also becoming smaller and smaller. This indicates that the control of particles on the wafer backside which has not been regarded as a problem so far is becoming important. Therefore, we considered that wafer backside is cleaned just before a wafer is transferred into the exposure equipment in order to prevent the occurrence of a Focus error and reduce the contamination of the exposure chuck. As a result, it was verified that the cleaning of wafer backside at the memory production line of the 70nm node can reduce the contamination of the exposure chuck and can extend the period of maintenance for the exposure equipment. Moreover, it was also verified that the cleaning of wafer backside can improve productivity.

Paper Details

Date Published: 1 April 2009
PDF: 6 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72730V (1 April 2009); doi: 10.1117/12.814021
Show Author Affiliations
S. Nishikido, Tokyo Electron Kyushu Ltd. (Japan)
T. Kitano, Tokyo Electron Kyushu Ltd. (Japan)
Y. Tokunaga, Tokyo Electron Kyushu Ltd. (Japan)
Marlene Strobl, Inotera Memories, Inc. (Taiwan)
Yu Chen Lin, Inotera Memories, Inc. (Taiwan)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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