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Proceedings Paper

Development of a novel methodology for effective partial die inspection and monitoring
Author(s): Byoung-Ho Lee; Tae-Yong Lee; Andrew Cross; Masami Aoki; HeungSoo Choi; YeonHo Pae
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Paper Abstract

Defect inspection is a challenge in the edge of wafer region and several new inspection tools and techniques have come to the market to fulfill this inspection need. Current inspection methodology excludes inspection of partial die located at the wafer edge, which has lead to the development of a technique available for patterned wafer inspection tools to inspect these partially printed die. In this paper we identify and develop a robust methodology for the characterization and monitoring of defectivity on the partially printed edge die. The methodology includes the development of methods for inspection optimisation requirements, characterization and isolation of defect sources, optimisation of clustering and binning and control of partial die defectivity.

Paper Details

Date Published: 23 March 2009
PDF: 6 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72723K (23 March 2009); doi: 10.1117/12.813994
Show Author Affiliations
Byoung-Ho Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Tae-Yong Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Andrew Cross, KLA-Tencor Corp. (United States)
Masami Aoki, KLA-Tencor Corp. (United States)
HeungSoo Choi, KLA-Tencor Corp. (United States)
YeonHo Pae, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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