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Proceedings Paper

Cr migration on 193nm binary photomasks
Author(s): John Bruley; Geoffrey Burr; Robert E. Davis; Philip Flaitz; William D. Hinsberg; Frances A. Houle; Dolores C. Miller; Michael Pike; Jed Rankin; Alfred Wagner; Andrew Watts
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Paper Abstract

A new type of chrome-on-glass (COG) photomask defect was observed in 2006. Absorber material migrated into vias on dark field masks, partially obscuring the incident 193nm light and thereby causing the imaged photoresist to be underexposed. Through detailed characterization of new and defective photomasks and their histories it was determined that the migration is not caused by any unusual line events or faulty mask handling procedures. Rather, it is an inevitable result of mask use under specific conditions. Four essential elements have been identified: the presence of Cr, 193nm light exposure, charge, and water vapor and their roles elucidated through modeling studies and existing literature. We have reproduced Cr migration in the laboratory, demonstrating that these four elements are necessary and sufficient for this type of defect to occur. The only way to avoid Cr migration is to avoid reactions with water vapor.

Paper Details

Date Published: 23 March 2009
PDF: 6 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 727215 (23 March 2009); doi: 10.1117/12.813934
Show Author Affiliations
John Bruley, IBM Thomas J. Watson Research Ctr. (United States)
Geoffrey Burr, IBM Almaden Research Ctr. (United States)
Robert E. Davis, IBM Corp. (United States)
Philip Flaitz, IBM Corp. (United States)
William D. Hinsberg, IBM Almaden Research Ctr. (United States)
Frances A. Houle, IBM Almaden Research Ctr. (United States)
Dolores C. Miller, IBM Almaden Research Ctr. (United States)
Michael Pike, IBM Corp. (United States)
Jed Rankin, IBM Corp. (United States)
Alfred Wagner, IBM Thomas J. Watson Research Ctr. (United States)
Andrew Watts, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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