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Proceedings Paper

Contact analysis studies of an ESCAP resist with scCO2 compatible additives
Author(s): Abhinav Rastogi; Gregory N. Toepperwein; Manabu Tanaka; Robert A. Riggleman; Juan J. de Pablo; Christopher K. Ober
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Paper Abstract

Rapid technological advances have presented several environmental issues and call for the use of environmentally friendly processes. Supercritical carbon dioxide (scCO2) is a widely used solvent that can enhance processing performance in photolithography, especially in the development step. Supercritical CO2 is a good solvent for many nonpolar molecules with low molecular weights. However, it is generally a very poor solvent for high molecular-weight photoresists. Recently researchers have reported the ability to develop conventional polymeric resists in scCO2 using tailored soluble additives. The mechanism of dissolution of a polymer photoresist in scCO2 in the presence of these additives is clearly at a very early stage of understanding. To understand this mechanism in more detail, we synthesized a series of scCO2 compatible quaternary ammonium salts (QAS) and used them as additives in the dry development of model and commercially available photoresists. In this paper, we describe the various interactions that the QAS additive has with the different functional groups on the polymer resist to assist its dissolution in scCO2. Using contact analysis plots we report the dominant interactions between the additive and the resist material. We report the results with two salts (QAS-I and QAS-II) to show the structure-property relation of these amphiphilic additives with an ESCAP resist. Finally, we report the lithographic evaluation of a commercial EUV resist using an appropriate scCO2 compatible QAS after development in scCO2.

Paper Details

Date Published: 1 April 2009
PDF: 8 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72734F (1 April 2009); doi: 10.1117/12.813814
Show Author Affiliations
Abhinav Rastogi, Cornell Univ. (United States)
Gregory N. Toepperwein, Univ. of Wisconsin, Madison (United States)
Manabu Tanaka, Cornell Univ. (United States)
Robert A. Riggleman, Univ. of Wisconsin, Madison (United States)
Juan J. de Pablo, Univ. of Wisconsin, Madison (United States)
Christopher K. Ober, Cornell Univ. (United States)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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