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Proceedings Paper

Fluorinated polymethacrylates as highly sensitive non-chemically amplified e-beam resists
Author(s): Jeff R. Strahan; Jacob R. Adams; Wei-Lun Jen; Anja Vanleenhove; Colin C. Neikirk; Timothy Rochelle; Roel Gronheid; C. Grant Willson
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Paper Abstract

In an effort to improve upon the sensitivity of commercial non-chemically amplified e-beam resists, four polyacrylates functionalized with α-CF3 and/or CH2CF3 alkoxy substituents were studied. The α-CF3 substituent is known to increase backbone-scission efficiency while simultaneously eliminating acidic out-gassing and cross-linking known to occur in α- halogen substituted polyacrylates. Contrast curves for the polymeric α-CF3 acrylates, generated through e-beam exposure, showed the resists required an order of magnitude less dose than the current industry-standards, PMMA and ZEP. The fundamental sensitivity of these materials to backbone scissioning was determined via 60Co γ-ray irradiation. The chain scissioning, G(s), and cross-linking, G(x), values calculated from the resulting change in molecular weight demonstrated that all fluorinated resists possess higher G(s) values than either PMMA or ZEP and have no detectable G(x) values. Utilizing e-beam and EUV interference lithographies, the photospeed of PMTFMA was found to be 2.8x and 4.0x faster, respectively, than PMMA.

Paper Details

Date Published: 1 April 2009
PDF: 10 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72733G (1 April 2009); doi: 10.1117/12.813736
Show Author Affiliations
Jeff R. Strahan, The Univ. of Texas at Austin (United States)
Jacob R. Adams, The Univ. of Texas at Austin (United States)
IMEC vwz (Belgium)
Wei-Lun Jen, The Univ. of Texas at Austin (United States)
Anja Vanleenhove, NXP Semiconductors (Belgium)
Colin C. Neikirk, The Univ. of Texas at Austin (United States)
Timothy Rochelle, The Univ. of Texas at Austin (United States)
Roel Gronheid, IMEC (Belgium)
C. Grant Willson, The Univ. of Texas at Austin (United States)


Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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