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Proceedings Paper

A novel fast 3D resist simulation method using Chebyshev expansion
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Paper Abstract

A new simulation method with Chebyshev expansion is proposed to calculate three-dimensional resist profiles in a short time using Fast Cosine Transform (FCT) algorithm. This method can be applied to the solution of the full 3D model for OPC and LCC, and it is valid to evaluate the cross-sectional resist shape under the condition where the influence of reflection wave from the underlayer is significant. We show the results of evaluation with regard to accuracy and precision, expanding three-dimensional profiles using Chebyshev expansion. In addition, we report the comparison with numerical experiments.

Paper Details

Date Published: 16 March 2009
PDF: 7 pages
Proc. SPIE 7274, Optical Microlithography XXII, 727432 (16 March 2009); doi: 10.1117/12.813606
Show Author Affiliations
Masanori Takahashi, Toshiba Corp. Semiconductor Co. (Japan)
Satoshi Tanaka, Toshiba Corp. Semiconductor Co. (Japan)
Shoji Mimotogi, Toshiba Corp. Semiconductor Co. (Japan)
Soichi Inoue, Toshiba Corp. Semiconductor Co. (Japan)


Published in SPIE Proceedings Vol. 7274:
Optical Microlithography XXII
Harry J. Levinson; Mircea V. Dusa, Editor(s)

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