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Proceedings Paper

Post-develop blob defect reduction
Author(s): Masahiko Harumoto; Sei Negoro; Akihiro Hisai; Michio Tanaka; Glen Mori; Mark Slezak
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Paper Abstract

This study reports on blob defect reduction and process impacts by Acid Rinse System. Blob defects that appear after develop are a common problem with i-line, KrF, ArF and ArF-immersion resists. Last year we reported Blob defects were influenced by the develop process and were able to be decreased by improving process. Furthermore we identified blob defects were caused from alkaline developer and could be reduced by neutralizing Acid Rinse. In this work, we designed a novel develop process and system that reduced blob defects. We evaluated this system on the non-topcoat immersion resist. The blob defects on immersion resist were also eliminated by this system but affected by each resist surface condition. We also evaluated the impacts from Acid rinse for some kinds of patterns and resists, because we needed to indentify whether there were negatively process impacts. We reports that Acid Rinse System significantly reduced blob defect counts, and whether influenced other process impacts. Finally we report the mechanism of the blob defects reduction.

Paper Details

Date Published: 1 April 2009
PDF: 12 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72730P (1 April 2009); doi: 10.1117/12.813605
Show Author Affiliations
Masahiko Harumoto, SOKUDO Co., Ltd. (Japan)
Sei Negoro, SOKUDO Co., Ltd. (Japan)
Akihiro Hisai, SOKUDO Co., Ltd. (Japan)
Michio Tanaka, SOKUDO Co., Ltd. (United States)
Glen Mori, SOKUDO Co., Ltd. (United States)
Mark Slezak, JSR Micro, Inc. (United States)

Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

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