Share Email Print

Proceedings Paper

Simulation of optical lithography in the presence of topography and spin-coated films
Author(s): Stewart A. Robertson; Michael T. Reilly; Trey Graves; John J. Biafore; Mark D. Smith; Damien Perret; Vladimir Ivin; Sergey Potashov; Mikhail Silakov; Nikolay Elistratov
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Experimental results on etched silicon wafers show that after two consecutive spin-coat processes the upper material surface achieves near planar flatness. This was observed for three separate dual layer BARC systems and the case of photoresist over a single layer BARC. The wafer topography step height (60 nm) and the thicknesses of the organic films (20 nm - 100 nm) were typical for state-of-the-art IC manufacturing lithography processes. A lithographic proximity effect driven by wafer topography pitch was experimentally observed for a single layer BARC system. The response was reproduced with good quantitative accuracy using rigorous wafer plane EMF simulations incorporating ideal etched wafer topography, a planarizing resist film and a simple spin-coat approximation of the BARC coverage, as observed by x-section SEM. In contrast, simulations assuming the limiting cases of a perfectly conformal BARC and a perfectly planarizing BARC failed to predict any meaningful proximity effect.

Paper Details

Date Published: 1 April 2009
PDF: 12 pages
Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727340 (1 April 2009); doi: 10.1117/12.813557
Show Author Affiliations
Stewart A. Robertson, KLA-Tencor Corp. (United States)
Michael T. Reilly, Rohm and Haas Electronic Materials LLC (United States)
Trey Graves, KLA-Tencor Corp. (United States)
John J. Biafore, KLA-Tencor Corp. (United States)
Mark D. Smith, KLA-Tencor Corp. (United States)
Damien Perret, Rohm and Haas Electronic Materials (France)
Vladimir Ivin, Mirantis (Russian Federation)
Sergey Potashov, Mirantis (Russian Federation)
Mikhail Silakov, Mirantis (Russian Federation)
Nikolay Elistratov, Mirantis (Russian Federation)

Published in SPIE Proceedings Vol. 7273:
Advances in Resist Materials and Processing Technology XXVI
Clifford L. Henderson, Editor(s)

© SPIE. Terms of Use
Back to Top