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Proceedings Paper

Modeling and experiments of non-telecentric thick mask effects for EUV lithography
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Paper Abstract

Various issues related to non-telecentric mask effects for EUV lithography will be discussed in this paper. First, a raytracing approach will provide a conceptual description as to the nature of non-telecentric thick mask effects, highlighting the behavior of various edge types and corners. Rigorous modeling of these effects are discussed along with a few consequences of improper modeling. A series of simulation and experimental studies are presented to probe both the one- and two-dimensional impact of thick mask effects. It will be shown that a simple constant edge bias appears sufficient for 1D features, but begins to break down when space-widths are less than about 45 nm. Investigation into the impact of corners and small 2D features indicates that a simple edge-based bias also breaks down for edge lengths less than about 60nm. A sample set of rules-based post-OPC HV corrections for 22nm node dimensions are proposed, although based on experimental results, it is concluded that more accurate resist modeling and scanner stability are required before being able to precisely predict and control HV effects. Finally, with some simplifying assumptions, simulation is used to predict the extent of potential HV effects of future EUV imaging systems.

Paper Details

Date Published: 17 March 2009
PDF: 12 pages
Proc. SPIE 7271, Alternative Lithographic Technologies, 72711C (17 March 2009); doi: 10.1117/12.813536
Show Author Affiliations
Gregory McIntyre, IBM Corp. (United States)
Chiew-seng Koay, IBM Corp. (United States)
Martin Burkhardt, IBM Corp. (United States)
Hiro Mizuno, Toshiba America, Inc. (United States)
Obert R. Wood, GLOBALFOUNDRIES Inc. (United States)


Published in SPIE Proceedings Vol. 7271:
Alternative Lithographic Technologies
Frank M. Schellenberg; Bruno M. La Fontaine, Editor(s)

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