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Proceedings Paper

Packaging of a silicon-based biochip
Author(s): Thomas Velten; Margit Biehl; Werner Haberer; Timo Koch; Pedro Ortiz; Neil Keegan; Julia Spoors; John Hedley; Calum McNeil
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Paper Abstract

We present a sophisticated method for the packaging of a micro-electro-mechanical biochip, which leaves the sensitive surface area of the chip uncovered to allow for direct contact to aqueous environment. Together with adequate integration in a fluidic cartridge, the packaging method allows for the realization of a lab-on-chip (LOC). A fluidic interface to the cartridge is provided as well as electrical interfaces to the biochip electronics located in a readout instrument. The biochip features a central membrane and electrodes, both located in the central chip area, and bond pads distributed along the rim of the chip. The packaging method ensures a hermetic separation between the membrane sensing area interfaced to liquids and the bond pad area. Challenging was the fact that both, the freely moving membrane and the bond pads for electrical interconnection are positioned very close to each other on the same chip surface area. We mounted the biochip into a recess of a rigid printed circuit board and electrically connected it to the latter with a proprietary MicroFlex Interconnection (MFI) technology. A customized coating method using a specially shaped silicone casting-mold ensured a very thin, hermetic encapsulation, which left the membrane safe and freely accessible.

Paper Details

Date Published: 9 February 2009
PDF: 10 pages
Proc. SPIE 7206, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII, 720603 (9 February 2009); doi: 10.1117/12.813500
Show Author Affiliations
Thomas Velten, Fraunhofer Institut für Biomedizinische Technik (Germany)
Margit Biehl, Fraunhofer Institut für Biomedizinische Technik (Germany)
Werner Haberer, Fraunhofer Institut für Biomedizinische Technik (Germany)
Timo Koch, Fraunhofer Institut für Biomedizinische Technik (Germany)
Pedro Ortiz, Univ. of Newcastle Upon Tyne (United Kingdom)
Neil Keegan, Univ. of Newcastle Upon Tyne (United Kingdom)
Julia Spoors, Univ. of Newcastle Upon Tyne (United Kingdom)
John Hedley, Univ. of Newcastle Upon Tyne (United Kingdom)
Calum McNeil, Univ. of Newcastle Upon Tyne (United Kingdom)


Published in SPIE Proceedings Vol. 7206:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)

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