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Proceedings Paper

Characterization and optimization of residual layer thickness during UV imprint process for singlemode waveguide fabrication
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Paper Abstract

We report on the fabrication and characterization of a residual layer resulting from UV imprinting of singlemode optical waveguide. We have measured the residual thickness formed from the imprinting process for several-um-size singlemode waveguide fabrication using the parameters of the imprinting pressure, dropped volume, and viscosity of the used polymer. We found that the residual layer thickness is dependent on both the initial polymer volume and process pressure and the initial polymer volume is more critical than process pressure. Viscosity of polymer also affects the residual layer thickness, the lowest residual layer thickness of 29nm is achieved with nano-imprinting resin, 0.3uL volume, and imprint pressure more than 20bar. Even with optical resin, the residual layer thickness of 60nm is achieved with 0.3uL volume and imprinting pressure of 30bar.

Paper Details

Date Published: 10 February 2009
PDF: 8 pages
Proc. SPIE 7219, Optoelectronic Integrated Circuits XI, 72190R (10 February 2009); doi: 10.1117/12.813482
Show Author Affiliations
Shinmo An, Inha Univ. (Korea, Republic of)
Hyun-Shik Lee, Inha Univ. (Korea, Republic of)
Se-Guen Park, Inha Univ. (Korea, Republic of)
Beom-Hoan O, Inha Univ. (Korea, Republic of)
Seung-Gol Lee, Inha Univ. (Korea, Republic of)
El-Hang Lee, Inha Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 7219:
Optoelectronic Integrated Circuits XI
Louay A. Eldada; El-Hang Lee, Editor(s)

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